Hybrid Circuits

Circuitos híbridos

Hybrid circuits with Gauss quality. An alternative technology at your reach. Now available for the market. Send your project.

Reference in the Market, Gauss visualized in 2007 a great technological opportunity to be the first. As an innovative action, it acquired and incorporated to the manufacturing process the pioneering of manufacturing Hybrid circuits with Thick Film.

The Process

The circuit boards are built on a ceramic base. High precision printers print the conductors (layers) and resistors in Silkscreen, the resistors have their resistive values adjusted using the Laseer Trimming technology, which can be done in a passive or active way, tolerance of 5% up to 0,25%, determining a greater assertiveness and quality to the circuits in relation to the project. The Hybrid circuit technology has many advantages over circuits built on fiber or phenolics.

Check out some of them:
– Miniaturization of circuits;
– Better performance in heat dissipation;
– Very low coefficient of expansion to thermal variations;
– Dielectric insulation;
– Multi-layered (crossover process);
– Passive and active resistor settings (homogenization of results);
– Double-sided circuits, metal bore;
– Use in harsh environments (temperature, vibration, etc.);
– High reliability;
– Flexibility to varied formats;
– Customization and secrecy;
– Competitive cost.


We have qualified professionals with vast experience proven in the use of this technology in the most diverse segments, which allows us to design and customize projects in different business areas.


In order to maintain the international standard of quality, we only use raw materials supplied by established world manufacturers. We certify compliance and traceability in 100% of parts by applying ISO9001 standards.

Gauss uses the technology of hybrid circuits (thick film) in the manufacture of its own Products such as: voltage regulators, ignition modules, MAP sensors, air flow meter, in order to provide customers with superior quality and performance.

We also work on special projects for customers:

– Telecommunications;
– White line;
– Automotive;
– Automation controls;
– Computing.


Understand each stage of the production process:

Project: Gauss engineers define the electrical lines and the placement of components in a layout. Thereafter, several photolithographed images are produced which subsequently can be used to the printing of circuit lines and masks.

Laser scribing: Gauss has the only Lumonics V150 equipment in brazilian Market, used for substrate scribing. The cutting lines made in the substrate by this laser gun separate circuits.

Printing of conductors: Using the system of high precision screen printing, with automated devices and cameras for the perfect adjustment of the screens, which allows the creation of conductors in the circuit.

Firing: After drying the printed conductors, the substrate goes through a furnace at 850ºC. The high temperature allows the printing material to turn into low resistivity metal.

Printing of resistors: At this stage, the resistors are screend printed. Then the pieces are subjected to a new resistive mass acquires the consistency needed and electrical properties are defined.

Resistors trimming: using laser trimming on active or passive way to ensure that each resistor will get the exact value of the project designed. This technology ensures tolerances of 5% to 0.25%.

Coverage printing: a layer of coverage (organic/glass) is applied to protect the resistors and the conducting lines against oxidation. This step is where Gauss enhances the stability of the circuit and the quality of the process.

SMD Assembly: Here, Gauss assembles the electronics by Surface Mounting Device technology.

Inspections and final tests: to conclude the process, optical and visual inspections are performed, circuit to circuit, as well as individual dynamic tests. Everything to guarantee the full functionality of the product delivered to our customers.

Materials used:
a) Ceramic substrate
– Material: Ceramic aluminum oxide (96% AL2O3)
– Dimensions: 6.5 x 5.4 inches
– Thickness: 0.635 mm std, 1.2 mm max
– Density: 3.7 g / cm3
– Thermal conductivity: 0.35 W / cm * K @ 25C
– Electrical resistance: 10 ^ 14 Ohm * cm
– Dielectric constant: 9.5

b) Conductive Binders
– Material: PdAg 30mOhm / sq, PtAg 4 mOhm / sq, Ag 2 mOhm / sq, Au 3 mOhm / sq
– Minimum Width: 0.10 mm
– Minimum spacing: 0.10 mm

c) Resistive Folders:
– Resistivity: 10 mOhm / sq to 100 MOhm / sq
– Resistance Range: 0.1 Ohm to 1 GOhm
– Tolerance: 5% to 0.25% (ratio 0.15%)
– tc: 100 ppm / K to 15 ppm / K T = -55 C to 125 C
– Power: 300 mW / mm2

d) Capacitive folders
– Capacitance: 2 pF / mm2 to 200 pF / mm2
– Tolerance: +/- 20%

e) Inductive binders
Inductance: 2 nH to 100 nH
– Tolerance: + – 20%

Process steps